Air gap spacer formation for nano-scale semiconductor devices
US-2024079266-A1 · Mar 7, 2024 · US
US9105744B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105744-B2 |
| Application number | US-201213410207-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2012 |
| Priority date | Mar 1, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Semiconductor devices and manufacturing and design methods thereof are disclosed. In one embodiment, a semiconductor device includes an active FinFET disposed over a workpiece comprising a first semiconductive material, the active FinFET comprising a first fin. An electrically inactive FinFET structure is disposed over the workpiece proximate the active FinFET, the electrically inactive FinFET comprising a second fin. A second semiconductive material is disposed between the first fin and the second fin.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor device, the method comprising: providing a fin-shaped workpiece, the workpiece comprising a first semiconductive material; forming a plurality of active fin field effect transistors (FinFETs) over the workpiece, each of the plurality of electrically active FinFET structures comprising a gate extending over the workpiece; forming a plurality of electrically inactive FinFET structures over the workpiece proximate t…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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