Semiconductor device and method of manufacturing same
US-2024395697-A1 · Nov 28, 2024 · US
Trench formation using rounded hard mask
US9105697B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105697-B2 |
| Application number | US-201314103491-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 11, 2013 |
| Priority date | Dec 11, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A method embodiment includes forming a hard mask over a dielectric layer, patterning the hard mask to form an opening, forming a passivation layer on sidewalls of the opening, and forming a trench in the dielectric layer by extending the opening into the dielectric layer using an etching process. The sidewalls of the opening are etched to form a rounded profile in the hard mask and a substantially perpendicular profile in the dielectric layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: forming a hard mask over a dielectric layer; patterning the hard mask to form an opening; forming a passivation layer on sidewalls of the opening; forming a trench in the dielectric layer by extending the opening into the dielectric layer using an etching process; and etching the sidewalls of the opening to form a rounded profile in the hard mask and a substantially perpendicular profile in the dielectric layer.…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9105697B2 cover?
- A method embodiment includes forming a hard mask over a dielectric layer, patterning the hard mask to form an opening, forming a passivation layer on sidewalls of the opening, and forming a trench in the dielectric layer by extending the opening into the dielectric layer using an etching process. The sidewalls of the opening are etched to form a rounded profile in the hard mask and a substantia…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10W20/081. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).