Semiconductor package with conductive heat spreader

Patent metadata

Field	Value
Publication number	US-9105619-B2
Application number	US-201313769198-A
Country	US
Kind code	B2
Filing date	Feb 15, 2013
Priority date	Mar 7, 2006
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package.

First claim

What is claimed is:

1. A semiconductor package comprising:
a lead frame comprising a plurality of leads;
a semiconductor die that is supported by said lead frame and is electrically connected to said plurality of leads on a first surface of said semiconductor die;
a compressible heat spreader that is thermally and mechanically coupled to a second surface of said semiconductor die;
said compressible heat spreader comprising a cup portion that is thermally and mechanically cou…

Assignees

• Int Rectifier Corp

Inventors

• Briere Michael A
• Cheah Chuan
• Hu Kunzhong

Classifications

• H10W90/736

  Electricity · mapped topic

• H10W90/726

  Electricity · mapped topic

• H10W72/877

  Electricity · mapped topic

• H10W74/111 Primary

  Electricity · mapped topic

• H10W70/461

  Electricity · mapped topic