Power module thermal management system
US-2024096747-A1 · Mar 21, 2024 · US
Package/heatsink system for electronic device
US9105598B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105598-B2 |
| Application number | US-201213537166-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2012 |
| Priority date | Jun 30, 2011 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.
First claim
Opening claim text (preview).
What is claimed is: 1. A system, comprising: an insulating body configured to embed at least one chip in which at least one electronic component is integrated, the insulating body having a mounting surface configured to be mounted to a board and a free surface opposite the mounting surface and a peripheral side surface between the mounting and free surfaces, a first pin surface exposed from the mounting surface of the insulating body and coplanar with said mounting surface; a…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W40/226Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9105598B2 cover?
- An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one…
- Who is the assignee on this patent?
- Stella Cristiano Gianluca, Privitera Concetto, St Microelectronics Srl
- What technology area does this patent fall under?
- Primary CPC classification H10W40/226. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).