Electric power converter and method of manufacturing the same

US9105597B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105597-B2
Application numberUS-201214367868-A
CountryUS
Kind codeB2
Filing dateJan 23, 2012
Priority dateJan 23, 2012
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electric power converter that can easily be assembled is provided. An electric power converter includes a semiconductor stacking unit, a frame and a spring unit. The semiconductor stacking unit has a configuration in which the semiconductor modules and coolers are stacked. The spring unit is inserted between one end of the semiconductor stacking unit in a stacking direction, and a support provided on the frame, and fixes the semiconductor stacking unit while applying pressure thereto. The spring unit is provided with a first plate, a second plate, and a coil spring sandwiched between the first and second plates. A recess is provided in the first plate so as to have a gap between the first plate and the end surface of the semiconductor stacking unit. A penetrating passage through which the entire spring unit passes along a bottom of the recess is provided in the spring unit.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electric power converter comprising: a semiconductor stacking unit configured to alternately stack a flat type semiconductor module and a flat type cooler, the semiconductor module containing a semiconductor element; a frame for placing the semiconductor stacking unit; and a spring unit that applies pressure to the semiconductor unit, the spring unit being inserted between an end surface of the semiconductor unit in a stacking direction and a wa…

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What does patent US9105597B2 cover?
An electric power converter that can easily be assembled is provided. An electric power converter includes a semiconductor stacking unit, a frame and a spring unit. The semiconductor stacking unit has a configuration in which the semiconductor modules and coolers are stacked. The spring unit is inserted between one end of the semiconductor stacking unit in a stacking direction, and a support pr…
Who is the assignee on this patent?
HIRONAKA Ryouji, Imura Hitoshi, Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W40/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).