Semiconductor device and method for forming the same
US-2024395669-A1 · Nov 28, 2024 · US
US9105597B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105597-B2 |
| Application number | US-201214367868-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 23, 2012 |
| Priority date | Jan 23, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Official abstract text for this publication.
An electric power converter that can easily be assembled is provided. An electric power converter includes a semiconductor stacking unit, a frame and a spring unit. The semiconductor stacking unit has a configuration in which the semiconductor modules and coolers are stacked. The spring unit is inserted between one end of the semiconductor stacking unit in a stacking direction, and a support provided on the frame, and fixes the semiconductor stacking unit while applying pressure thereto. The spring unit is provided with a first plate, a second plate, and a coil spring sandwiched between the first and second plates. A recess is provided in the first plate so as to have a gap between the first plate and the end surface of the semiconductor stacking unit. A penetrating passage through which the entire spring unit passes along a bottom of the recess is provided in the spring unit.
Opening claim text (preview).
The invention claimed is: 1. An electric power converter comprising: a semiconductor stacking unit configured to alternately stack a flat type semiconductor module and a flat type cooler, the semiconductor module containing a semiconductor element; a frame for placing the semiconductor stacking unit; and a spring unit that applies pressure to the semiconductor unit, the spring unit being inserted between an end surface of the semiconductor unit in a stacking direction and a wa…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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