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Solid-state image pickup device, method for manufacturing the same, and electronic apparatus
US9105543B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105543-B2 |
| Application number | US-201313785998-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 5, 2013 |
| Priority date | Oct 5, 2009 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A solid-state image pickup device is provided. The first pixel isolation member includes impurity ions implanted in a first region of the semiconductor substrate so that at least two pixels are disposed between portions of the first region when viewed from a surface of the substrate. A second isolation member includes a trench having an electrocondcutive material disposed therein. The trench is formed in a second region of the substrate different from the first pixel isolation member so that the at least two pixels are disposed between portions of the second region when viewed from the surface of the semiconductor substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A solid-state image pickup device comprising: a semiconductor substrate including a plurality of pixels, each of the plurality of pixels including a photoelectric conversion element; a first pixel isolation member including impurity ions implanted in a first region of the semiconductor substrate so that at least two of the plurality of pixels are disposed between portions of the first region when viewed from a surface of the semiconductor substrate; and…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10F39/807Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9105543B2 cover?
- A solid-state image pickup device is provided. The first pixel isolation member includes impurity ions implanted in a first region of the semiconductor substrate so that at least two pixels are disposed between portions of the first region when viewed from a surface of the substrate. A second isolation member includes a trench having an electrocondcutive material disposed therein. The trench is…
- Who is the assignee on this patent?
- Sony Corp
- What technology area does this patent fall under?
- Primary CPC classification H10F39/807. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).