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Method and system for obtaining optical proximity correction model calibration data
US9105079B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105079-B2 |
| Application number | US-201414283581-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 21, 2014 |
| Priority date | Aug 22, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A method may be implemented for obtaining calibration data for use in calibrating an optical proximity correction model. The method may include capturing an image for each portion of a plurality of portions of a wafer to obtain captured images. The method may further include assembling at least portions of the captured images to form an assembled image. The method may further include mapping layout data of the wafer with the assembled image. The method may further include selecting portions of the assembled image based on the layout data of the wafer. The method may further include obtaining data associated with the portions of the assembled image as the calibration data.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for obtaining calibration data for use in calibrating an optical proximity correction model, the method comprising: capturing, using an image-capturing device, an image for each portion of a plurality of portions of a wafer to obtain captured images, the captured images including a first image and a second image, the first image including an image of a first portion of the wafer, the second image including an image of a second portion of the wafer,…
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Electricity · mapped topic
Physics · mapped topic
- G03F1/36Primary
Physics · mapped topic
Physics · mapped topic
Electricity · mapped topic
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- What does patent US9105079B2 cover?
- A method may be implemented for obtaining calibration data for use in calibrating an optical proximity correction model. The method may include capturing an image for each portion of a plurality of portions of a wafer to obtain captured images. The method may further include assembling at least portions of the captured images to form an assembled image. The method may further include mapping la…
- Who is the assignee on this patent?
- Semiconductor Mfg Int Shanghai
- What technology area does this patent fall under?
- Primary CPC classification G03F1/36. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).