Diagnostic device, semiconductor manufacturing equipment system, semiconductor equipment manufacturing system, and diagnostic method
US-2024321608-A1 · Sep 26, 2024 · US
US9103768B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9103768-B2 |
| Application number | US-201213680654-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2012 |
| Priority date | Feb 29, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Official abstract text for this publication.
Disclosed is an analysis system and method for visualizing heat conduction of a solid state sample. The analysis system includes a sealed jig chamber, a jig, an air tempering unit, and a thermal image camera. The sealed jig chamber includes a chamber door for opening/closing the jig chamber. The jig is removeably mounted in the jig chamber and comprises a heat source in surface contact with a solid state sample to induce the heat conduction of the solid state sample. The air tempering unit supplies hot air into the jig and supplies cool air into the jig chamber. The thermal image camera photographs the heat conduction of the solid state sample to acquire a thermal image or video.
Opening claim text (preview).
What is claimed is: 1. An analysis system for visualizing heat conduction, comprising: a sealed jig chamber including a chamber door configured to open and close the jig chamber; a jig removeably mounted in the jig chamber and including a heat source in surface contact with a solid state sample to induce the heat conduction of the solid state sample; an air tempering unit configured to supply hot air into the jig and supply cool air into the jig chamber; and a thermal image…
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