Method and Apparatus for Laser Cutting Transparent and Semitransparent Substrates
US-2015367442-A1 · Dec 24, 2015 · US
Laser processing method
US9102005B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9102005-B2 |
| Application number | US-9420906-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 16, 2006 |
| Priority date | Nov 25, 2005 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52 , the tape 23 is restrained from biting into fine pores of the sheet 53 . As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7 , no strong bending stress acts on the object 1 . This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.
First claim
Opening claim text (preview).
The invention claimed is: 1. A laser processing method including the steps of: securing a wafer-like object to be processed onto an expandable holding member stuck to a frame; holding the wafer-like object and the expandable holding member onto a porous sheet and a porous suction table of a vacuum chuck by suction, the porous sheet being interposed between the porous suction table and the expandable holding member and being in direct contact with the porous suction table on one…
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Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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- What does patent US9102005B2 cover?
- A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum…
- Who is the assignee on this patent?
- Muramatsu Kenichi, Sakamoto Takeshi, Hamamatsu Photonics Kk
- What technology area does this patent fall under?
- Primary CPC classification B23K26/53. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).