Component mounting device and component mounting method
US-2015382522-A1 · Dec 31, 2015 · US
T-flex bonder
US9101083B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101083-B2 |
| Application number | US-201213609248-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2012 |
| Priority date | Sep 10, 2012 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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Abstract
Official abstract text for this publication.
A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for aligning and bonding a flexible circuit having a plurality of attaching surfaces to a plurality of mounting areas, the method comprising: pre-positioning the flexible circuit in a geometry substantially the same as a final geometry taken by the flexible circuit once it is bonded to the plurality of mounting areas; securing the flexible circuit to a securing mechanism, the securing mechanism having at least as many securing areas as there are a…
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Frequently asked questions
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- What does patent US9101083B2 cover?
- A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodimen…
- Who is the assignee on this patent?
- Grespan Silvio, Hsu Shih-Min, Wu Heng-Hsi, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/32. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).