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US-12183868-B2 · Dec 31, 2024 · US
Methods of laser marking semiconductor substrates
US9099481B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099481-B2 |
| Application number | US-201414200283-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 7, 2014 |
| Priority date | Mar 15, 2013 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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Abstract
Official abstract text for this publication.
In one embodiment, methods for making semiconductor devices are disclosed.
First claim
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What is claimed is: 1. A method comprising: providing a semiconductor substrate comprising: a base substrate having a first semiconductor material; a buried structure; and a device layer having a second semiconductor material, wherein the buried structure is disposed between the base substrate and the device layer; and laser marking the semiconductor substrate, wherein the buried structure has a thickness equal to about k×λ laser /(2×n), wherein: λ laser is a waveleng…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9099481B2 cover?
- In one embodiment, methods for making semiconductor devices are disclosed.
- Who is the assignee on this patent?
- Semiconductor Components Ind
- What technology area does this patent fall under?
- Primary CPC classification H10W46/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).