Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate
US-2024268119-A1 · Aug 8, 2024 · US
US9099337B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099337-B2 |
| Application number | US-201314089840-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 26, 2013 |
| Priority date | Nov 11, 2009 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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An integrated circuit includes an NMOS and a PMOS disposed over a substrate. The NMOS transistor includes a first gate dielectric structure over the substrate, a first work function metallic layer over the first gate dielectric structure, a conductive layer over the first work function metallic layer, and a silicide layer over the conductive layer. The PMOS transistor includes a second gate dielectric structure over the substrate, and a second work function metallic layer over the first gate dielectric structure. The PMOS transistor is devoid of any silicide material on the second work function metallic layer.
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What is claimed is: 1. An integrated circuit, comprising: an n-channel metal-oxide semiconductor (NMOS) transistor disposed over a substrate, the NMOS transistor comprising: a first gate dielectric structure over the substrate; a first work function metallic layer over the first gate dielectric structure; a conductive layer over the first work function metallic layer; and a silicide layer over the conductive layer; and a p-channel metal-oxide semiconductor (PMOS) transi…
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