Semiconductor device
US-2024421022-A1 · Dec 19, 2024 · US
Semiconductor device with thick bottom metal and preparation method thereof
US9087828B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9087828-B2 |
| Application number | US-201313797440-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2013 |
| Priority date | Mar 12, 2013 |
| Publication date | Jul 21, 2015 |
| Grant date | Jul 21, 2015 |
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Abstract
Official abstract text for this publication.
A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and a plastic package body.
First claim
Opening claim text (preview).
The invention claimed is: 1. A preparation method of a semiconductor device with a thick bottom metal comprises the following steps: providing a lead frame including a plurality of die paddles, wherein the adjacent die paddles are connected to each other by one or more connecting parts, each connecting part comprises a support part arranged at a back surface of the connecting part and extending along a direction away from the back surface, wherein bottom surfaces of all support pa…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9087828B2 cover?
- A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and …
- Who is the assignee on this patent?
- Yilmaz Hamza, Xue Yan Xun, Lu Jun, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/778. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).