Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-9070549-B2
Application number	US-68079908-A
Country	US
Kind code	B2
Filing date	Sep 22, 2008
Priority date	Oct 1, 2007
Publication date	Jun 30, 2015
Grant date	Jun 30, 2015

Abstract

A drying gas is supplied into a drying chamber in a substantially horizontal direction, an obliquely downward direction descendent from the substantially horizontal direction, or a vertically downward direction under a state where a wafer is immersed in a cleaning liquid in a cleaning tank. The wafer is moved from the cleaning tank into the drying chamber, with the drying gas being supplied into the drying chamber. At this time, the supply of the drying gas into the drying chamber is stopped, under a condition where a part of the wafer is immersed in the cleaning liquid stored in the cleaning tank. After the movement of the wafer into the drying chamber has been finished, a drying gas is supplied into the drying chamber in an obliquely upward direction ascendant from the substantially horizontal direction or a vertically upward direction.

First claim

The invention claimed is:

1. A substrate processing apparatus comprising:
a cleaning tank configured to store a cleaning liquid for a substrate to be processed;
a drying chamber disposed above the cleaning tank, the drying chamber including a gas supply part therein, the gas supply part being configured to supply a drying gas;
a holding part configured to hold a substrate to be processed and to move the substrate to be processed between the cleaning tank and the drying chamber…

Assignees

• Tanaka Hiroshi
• Shiokawa Toshiyuki
• Inada Takao
• Tokyo Electron Ltd

Inventors

• Tanaka Hiroshi
• Shiokawa Toshiyuki
• Inada Takao

Classifications

• H10P72/0406

  Electricity · mapped topic

• H10P70/15 Primary

  Electricity · mapped topic

• H01L21/67028

  Electricity · mapped topic

• H01L21/02052 Primary

  Electricity · mapped topic