Method for manufacturing a film on a support having a non-flat surface
US-12087615-B2 · Sep 10, 2024 · US
Composite substrate and method for manufacturing composite substrate
US9070547B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9070547-B2 |
| Application number | US-201113295542-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 14, 2011 |
| Priority date | Nov 15, 2010 |
| Publication date | Jun 30, 2015 |
| Grant date | Jun 30, 2015 |
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- Title
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Abstract
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A metal film is formed on at least a surface of a second substrate composed of ceramic (step c), and a first substrate composed of a group nitride is bonded to the second substrate through the metal film (step d). Since the metal film generally has higher thermal conductivity than oxide films, a composite substrate having high heat dissipation can be produced as compared with a case where the first substrate is bonded to the second substrate through an oxide film. In addition, a step of out diffusion is not required because of nonuse of an oxide film, thereby simplifying the process.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a composite substrate comprising: (a) preparing a first substrate composed of a group 13 nitride and a second substrate composed of ceramic; (b) forming an ion-implanted layer in the first substrate by implanting hydrogen ions or rare gas ions into a back surface of the first substrate; (c) performing CMP polishing of the back surface of the first substrate and a surface of the second substrate, then forming, by a physical vapo…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9070547B2 cover?
- A metal film is formed on at least a surface of a second substrate composed of ceramic (step c), and a first substrate composed of a group nitride is bonded to the second substrate through the metal film (step d). Since the metal film generally has higher thermal conductivity than oxide films, a composite substrate having high heat dissipation can be produced as compared with a case where the f…
- Who is the assignee on this patent?
- Tai Tomoyoshi, Hori Yuji, Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).