Methods and systems for dissipating heat in optical communications modules

Patent metadata

Field	Value
Publication number	US-9063305-B2
Application number	US-201213684802-A
Country	US
Kind code	B2
Filing date	Nov 26, 2012
Priority date	Nov 26, 2012
Publication date	Jun 23, 2015
Grant date	Jun 23, 2015

Abstract

A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.

First claim

What is claimed is:

1. An optical communications module comprising:
a module housing comprising a front housing portion and a rear housing portion, wherein if the optical communications module is plugged into a receptacle formed in a front panel, the front housing portion is disposed in front of the front panel and the rear housing portion is disposed to the rear of the front panel;
at least a first electrical subassembly (ESA) disposed in the module housing, the ESA including at least a first circuit board, at least a first integrated circuit (IC) mounted on the first circuit board, and at least a first array of laser diodes mounted on the first circuit board;
a heat dissipation interface mechanically coupled to the rear housing portion and to said at least a first IC;
at least a first heat dissipation device mechanically coupled to the rear housing portion and thermally coupled to the heat dissipation interface, wherein at least a portion of heat generated by said at least a first IC is thermally coupled into the first heat dissipation device via the thermal coupling between the first heat dissipation device and the heat dissipation interface; and
at least a second heat dissipation device mechanically coupled to the front housing portion and thermally coupled to said at least a first array of laser diodes, wherein at least a portion of heat generated by the laser diodes is thermally coupled into the second heat dissipation device via the thermal coupling between the second heat dissipation device and the first array of laser diodes.

2. The optical communications module of claim 1 , further comprising:
at least a second ESA disposed in the module housing, the second ESA including at least a second circuit board, at least a second IC mounted on the second circuit board, and at least a first array of photodiodes mounted on the second circuit board, and wherein the heat dissipation interface is also thermally coupled to said at least a second IC and to said at least a first array of photodiodes such that at least a portion of heat generated by the second IC and the photodiodes is thermally coupled into the first heat dissipation device via the thermal coupling between the first heat dissipation device and the heat dissipation interface.

3. The optical communications module of claim 1 , wherein the second heat dissipation device has a thermal conductivity that ranges from about 2.0 Watts per meter-kelvin (W/m-K) to a maximum of about 50.0 W/m-K.

4. The optical communications module of claim 3 , wherein the second heat dissipation device is made of stainless steel.

5. The optical communications module of claim 4 , wherein the stainless steel is coated with thermally-insulating powder paint.

6. The optical communications module of claim 3 , wherein the second heat dissipation device is made of a ceramic material.

7. The optical communications module of claim 1 , wherein the heat dissipation interface and the second heat dissipation device are thermally decoupled from one another.

8. The optical communications module of claim 1 , wherein the module housing comprises a thermally-insulating material at least at locations where the heat dissipation interface and the second heat dissipation device are mechanically coupled to the rear and front housing portions, respectively.

9. The optical communications module of claim 8 , wherein the thermally-insulating material is plastic.

10. The optical communications module of claim 8 , wherein the thermally-insulating material is a ceramic.

11. The optical communications module of claim 1 , wherein the optical communications module is a CXP module.

12. The optical communications module of claim 11 , wherein the first array of laser diodes comprises at least twelve laser diodes, and wherein each laser diode is operated at a speed of at least 20 Gigabits per second (Gbps).

13. The optical communications module of claim 12 , wherein the second heat dissipation device dissipates enough heat to maintain the laser diodes at a temperature of about 70° Celsius (C).

14. A method for dissipating heat in an optical communications module, the method comprising:
providing an optical communications module comprising a module housing having at least a first electrical subassembly (ESA) disposed in the module housing, the module housing comprising a front housing portion and a rear housing portion, the first ESA including at least a first circuit board, at least a first integrated circuit (IC) mounted on the first circuit board, and at least a first array of laser diodes mounted on the first circuit board, wherein the rear housing portion includes a heat dissipation interface that is thermally coupled to at least the first IC and to a first heat dissipation device that is mechanically coupled to the rear housing portion, and wherein the front housing portion has at least a second heat dissipation device mechanically coupled thereto that is thermally coupled to said at least a first array of laser diodes, and wherein the optical communications module is plugged into a receptacle formed in a front panel such that the front housing portion is disposed in front of the front panel and the rear housing portion is disposed to the rear of the front panel;
dissipating at least a portion of heat generated by said at least a first IC with the first heat dissipation device via the thermal coupling between the first heat dissipation device and the heat dissipation interface; and
dissipating at least a portion of heat generated by the laser diodes with the second heat dissipation device via the thermal coupling between the second heat dissipation device and the first array of laser diodes.

15. The method of claim 14 , wherein at least a second ESA is disposed in the module housing, the second ESA including at least a second circuit board, at least a second IC mounted on the second circuit board, and at least a first array of photodiodes mounted on the second circuit board, and wherein the heat dissipation interface is also thermally coupled to said at least a second IC and to said at least a first array of photodiodes, the method further comprising:
dissipating at least a portion of heat generated by the second IC and the photodiodes with the first heat dissipation device via the thermal coupling between the first heat dissipation device and the heat dissipation interface.

16. The method of claim 14 , wherein the second heat dissipation device has a thermal conductivity that ranges from about 2.0 Watts per meter-kelvin (W/m-K) to a maximum of about 50.0 W/m-K.

17. The method of claim 16 , wherein the second heat dissipation device is made of stainless steel.

18. The method of claim 17 , wherein the stainless steel is coated with thermally-insulating powder paint.

19. The method of claim 16 , wherein the second heat dissipation device is made of a ceramic material.

20. The method of claim 14 , wherein the heat dissipation interface and the second heat dissipation device are thermally decoupled from one another.

21. The method of claim 14 , wherein the module housing comprises a thermally-insulating material at least at locations where the heat dissipation interface and the second heat dissipation device are mechanically coupled to the rear and front housing portions, respectively.

22. The method of claim 21 , wherein the thermally-insulating material is plastic.

23. The method of claim 21 , wherein the thermally-insulating material is a ceramic.

Assignees

• Avago Technologies General Ip

Inventors

• Mccolloch Laurence R
• Meadowcroft David J K
• Chan Seng-Kum

Classifications

• H01S5/02248

  Electricity · mapped topic

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H01S5/02208

  characterised by the shape of the housings · CPC title

• H04B10/40

  Transceivers · CPC title