Wiring board with built-in electronic component and method for manufacturing the same
US-9215805-B2 · Dec 15, 2015 · US
Method for manufacturing multi-layer printed circuit board
US9060458B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9060458-B2 |
| Application number | US-201113137352-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 8, 2011 |
| Priority date | Aug 9, 2010 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed; forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of the insulating films.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a multi-layer printed circuit board, comprising: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top an…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K3/4652Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9060458B2 cover?
- A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the seco…
- Who is the assignee on this patent?
- Oh Yoong, Choi Cheol Ho, Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K3/4652. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 16 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).