Package in Package (PiP) Electronic Device and Manufacturing Method thereof
US-2015348934-A1 · Dec 3, 2015 · US
Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof
US9059151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9059151-B2 |
| Application number | US-201113187505-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 20, 2011 |
| Priority date | Jul 20, 2010 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an encapsulant over the integrated circuit, over the upper structure, and in the opening with the base side exposed; removing the tie bars exposing a first surface and a second surface of the encapsulant below the first surface, and forming a die paddle from the upper structure and exposed from the second surface; and removing the leadframe from the base side forming island terminals from the upper protrusions exposed from the second surface and isolated from the die paddle.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacture of an integrated circuit packaging system comprising: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9059151B2 cover?
- A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an …
- Who is the assignee on this patent?
- Camacho Zigmund Ramirez, Bathan Henry Descalzo, Espiritu Emmanuel, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/042. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 16 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).