Chip-type electronic component
US-2024038754-A1 · Feb 1, 2024 · US
US9058973B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9058973-B2 |
| Application number | US-201113085970-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 13, 2011 |
| Priority date | Apr 13, 2011 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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Official abstract text for this publication.
Passive devices fabricated on glass substrates, methods of manufacture and design structures are provided. The method includes forming an opaque or semi-opaque layer on at least a first side of a glass substrate. The method further includes forming one or more passive devices on the opaque or semi-opaque layer on a second side of the glass substrate.
Opening claim text (preview).
What is claimed: 1. A method comprising: forming an opaque or semi-opaque layer on and directly contacting an entire a first side of a glass substrate; and forming one or more passive devices over the opaque or semi-opaque layer on a second side of the glass substrate; and entirely removing the opaque or semi-opaque layer from the first side of the glass substrate, prior to packaging, wherein the one or more passive devices are formed by etching and deposition of material pr…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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