Acoustic wave filter, communication module, and method for manufacturing the filter

Patent metadata

Field	Value
Publication number	US-9054674-B2
Application number	US-201213425001-A
Country	US
Kind code	B2
Filing date	Mar 20, 2012
Priority date	Sep 28, 2009
Publication date	Jun 9, 2015
Grant date	Jun 9, 2015

Abstract

An acoustic wave filter includes: a substrate; resonators that are arranged on the substrate and excite acoustic waves; a ground terminal on the substrate; interconnection lines interconnecting the resonators and connecting predetermined ones of the resonators to the ground terminal; and a shield electrode disposed so as to be close to and face the interconnection lines.

First claim

What is claimed is:

1. An acoustic wave filter comprising:
a substrate;
resonators that are arranged on the substrate and excite acoustic waves;
a ground terminal on the substrate;
interconnection lines interconnecting the resonators and connecting predetermined ends of the resonators to the ground terminal; and
shield electrodes disposed so that respective ones of the shield electrodes are close to and face corresponding ones of the interconnection lines,
wherein the shield electrodes are formed into a single shield electrode having openings, and respective ones of the openings are formed above corresponding ones of the resonators.

2. The acoustic wave filter according to claim 1 , wherein the shield electrodes further have portions that extend along the interconnection lines and have a width larger than that of the interconnection lines.

3. The acoustic wave filter according to claim 1 , further comprising at least one of a dielectric layer and an empty spacing provided between the interconnection lines and the shield electrodes.

4. The acoustic wave filter according to claim 1 , wherein at least one of the shield electrodes is not connected to the ground terminal.

5. The acoustic wave filter according to claim 1 , wherein at least one of the shield electrodes is connected to the ground terminal.

6. The acoustic wave filter according to claim 1 , wherein at least one of the shield electrodes is connected to an interconnection line of at least one of the resonators that is connected to the ground terminal.

7. The acoustic wave filter according to claim 1 , wherein the single shield electrode has a support post that holds at least one of the shield electrodes on the substrate and the post is electrically conductive.

8. The acoustic wave filter according to claim 7 , wherein the support post is formed of plated metal.

9. The acoustic wave filter according to claim 8 , wherein the support post includes copper as a main component.

10. A duplexer comprising filters, at least one of the filters including:
a substrate;
resonators that are arranged on the substrate and excite acoustic waves;
a ground terminal on the substrate;
interconnection lines interconnecting the resonators and connecting predetermined ends of the resonators to the ground terminal; and
shield electrodes disposed so that respective ones of the shield electrodes are close to and face corresponding ones of the interconnection lines,
wherein the shield electrodes are formed into a single shield electrode having openings, and respective ones of the openings are formed above corresponding ones of the resonators.

11. A communication module comprising a filter and a signal circuit connected to the filter, the filter including:
a substrate;
resonators that are arranged on the substrate and excite acoustic waves;
a ground terminal on the substrate;
interconnection lines interconnecting the resonators and connecting predetermined ends of the resonators to the ground terminal; and
shield electrodes disposed so that respective ones of the shield electrodes are close to and face corresponding ones of the interconnection lines,
wherein the shield electrodes are formed into a single shield electrode having openings, and respective ones of the openings are formed above corresponding ones of the resonators.

12. A method for manufacturing an acoustic wave filter, comprising:
forming, on a substrate, resonators exciting acoustic waves and interconnection lines interconnecting the resonators;
forming a dielectric layer so as to cover the interconnection lines;
forming a pattern having an opening on the dielectric layer by resist;
forming a metal layer in the opening; and
removing the resist,
the metal layer being a shield layer that is close to and face the interconnection lines through the dielectric layer.

Assignees

• Inoue Kazunori
• Tsutsumi Jun
• Matsumoto Kazuhiro
• Matsuda Takashi
• Taiyo Yuden Kk

Inventors

• Inoue Kazunori
• Tsutsumi Jun
• Matsumoto Kazuhiro
• Matsuda Takashi

Classifications

• H03H9/02125

  of parasitic elements · CPC title

• H03H9/706 Primary

  Duplexers · CPC title

• H03H3/02

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H03H9/6483

  Ladder SAW filters · CPC title

• H03H9/568

  consisting of a ladder configuration · CPC title