Apparatus and method for etching organic layer

Patent metadata

Field	Value
Publication number	US-9054342-B2
Application number	US-201314029296-A
Country	US
Kind code	B2
Filing date	Sep 17, 2013
Priority date	May 29, 2013
Publication date	Jun 9, 2015
Grant date	Jun 9, 2015

Abstract

Provided are an apparatus and method for etching an organic layer, in which an organic material deposited in a non-layer forming area of a substrate is etched. The apparatus includes an etching chamber; a plasma generator configured to supply plasma into the etching chamber; a stage disposed in the etching chamber and configured to support the substrate; and a mask configured to guide the plasma toward the non-pixel area.

First claim

What is claimed is:

1. A method of etching an organic layer disposed on a non-pixel area of a substrate, the method comprising:
disposing the substrate on a stage disposed in an etching chamber;
covering at least a portion of the substrate with a mask disposed in the etching chamber, by decreasing the distance between the stage and the mask; and
etching an organic layer disposed on a non-pixel area of the substrate, by using the mask to direct plasma supplied to the etching ch…

Assignees

• Samsung Display Co Ltd

Inventors

• Sakamoto Yoshiaki
• Ha Nam

Classifications

• H10P72/3314

  Electricity · mapped topic

• H10P72/0456 Primary

  Electricity · mapped topic

• H01L51/56 Primary

  Electricity · mapped topic

• H01J2237/334

  Electricity · mapped topic

• H01J37/32779

  Electricity · mapped topic