Photovoltaic cell set and cell module with an electronic circuit having a measurement area
US-2024154572-A1 · May 9, 2024 · US
US9054239B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9054239-B2 |
| Application number | US-201313917753-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 14, 2013 |
| Priority date | May 20, 2009 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A process of forming a front-grid electrode on a silicon wafer having an ARC layer, comprising the steps: (1) printing and drying a metal paste A comprising an inorganic content comprising 0.5 to 8 wt.-% of glass frit and having fire-through capability, wherein the metal paste A is printed on the ARC layer to form a bottom set of thin parallel finger lines, (2) printing and drying a metal paste B comprising an inorganic content comprising 0.2 to 3 wt.-% of glass frit over the bottom set of finger lines, wherein the metal paste B is printed in a grid pattern which comprises (i) thin parallel finger lines forming a top set of finger lines superimposing the bottom set of finger lines and (ii) busbars intersecting the finger lines at right angle, and (3) firing the double-printed silicon wafer, wherein the inorganic content of metal paste B contains less glass frit plus optionally present other inorganic additives than the inorganic content of metal paste A.
Opening claim text (preview).
What is claimed is: 1. A grid electrode formed on the front-side of a silicon wafer which has a p-type region, an n-type region, a p-n junction and an antireflective coating (ARC) layer on said front-side, wherein said grid electrode is produced according to a process comprising the steps of: (1) printing and drying a metal paste A having fire-through capability on the ARC layer, wherein the metal paste A is printed as thin parallel finger lines forming a bottom set of finger line…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.