Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
Stacked interconnect heat sink
US9054064B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9054064-B2 |
| Application number | US-201313921707-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 19, 2013 |
| Priority date | Jul 20, 2010 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat spreader configured to be attached to an electronic device substrate, comprising: a thermally conductive core; a heat spreader via passing through said thermally conductive core; and a connection point of said thermally conductive core configured to form a solder connection to an integrated circuit substrate plug. 2. The heat spreader as recited in claim 1 , wherein said thermally conductive core is an electrically conductiv…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9054064B2 cover?
- A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
- Who is the assignee on this patent?
- Lsi Corp, Avago Technologies General Ip
- What technology area does this patent fall under?
- Primary CPC classification H10W40/228. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).