Substrates having voltage switchable dielectric materials
US-9226391-B2 · Dec 29, 2015 · US
Method of determining reinforcement position of circuit substrate and substrate assembly
US9053262B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9053262-B2 |
| Application number | US-201213648335-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2012 |
| Priority date | Nov 22, 2011 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
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Abstract
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A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of determining a reinforcement position of a circuit board comprising: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electronic component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the cir…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
- H05K3/0005Primary
Electricity · mapped topic
- G06F30/20Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9053262B2 cover?
- A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located…
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/0005. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).