Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Distributed metal routing
US9041069B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9041069-B2 |
| Application number | US-201113007235-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2011 |
| Priority date | Jan 14, 2011 |
| Publication date | May 26, 2015 |
| Grant date | May 26, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first conductive layer on a substrate, the first conductive layer comprising a first plurality of conductive lines and a second plurality of conductive lines, wherein the first plurality of conductive lines is parallel to and interleaved with the second plurality of conductive lines, at least some of the first plurality of conductive lines serving as gates for transistors formed in the substrate; and a second conductive…
Assignees
Inventors
Classifications
- H10W20/484Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9041069B2 cover?
- A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance curre…
- Who is the assignee on this patent?
- Xiao You-Cheng, Chen Yen-Huei, Chen Jung-Hsuan, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10W20/484. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).