Electronic device and manufacturing method thereof
US-2024404831-A1 · Dec 5, 2024 · US
Method of polishing object to be polished
US9033764B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9033764-B2 |
| Application number | US-201113225961-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2011 |
| Priority date | Sep 9, 2010 |
| Publication date | May 19, 2015 |
| Grant date | May 19, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of polishing an object to be polished, wherein a surface of the object to be polished is processed into a concave or convex state by: placing the object to be polished on a polishing pad over a boundary between a first polishing region and a second polishing region, the polishing pad having a first polishing region where grooves are formed and a second polishing region where grooves are formed in a different state from that of the first polishing re…
Assignees
Inventors
Classifications
- H10P52/00Primary
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9033764B2 cover?
- The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves a…
- Who is the assignee on this patent?
- Kitamura Kazumasa, Nagae Tomoki, Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P52/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).