Overlap Joint Flex Circuit Board Interconnection
US-2024049392-A1 · Feb 8, 2024 · US
Printed circuit board and method for manufacturing the same
US9018539B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018539-B2 |
| Application number | US-201213487909-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 4, 2012 |
| Priority date | Dec 7, 2011 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern formed on the second insulator, and it is possible to reduce a size of the via without increasing an aspect ratio.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board comprising: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad, of which a first portion is embedded in the second insulator and of which a second portion is protruded out of the second insulator, and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern integr…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K1/115Primary
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9018539B2 cover?
- The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pa…
- Who is the assignee on this patent?
- Lee Han Ul, Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K1/115. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).