Current sensor for a printed circuit board
US-2024237215-A1 · Jul 11, 2024 · US
Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
US9018533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018533-B2 |
| Application number | US-201013203855-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 4, 2010 |
| Priority date | Mar 6, 2009 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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Abstract
Official abstract text for this publication.
Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.
First claim
Opening claim text (preview).
What is claimed is: 1. A cover-lay film comprising: a base material film comprising a resin or a rubber elastic body, the base material film having a textured surface created on at least a part of one surface of the base material film, and a non-textured surface on the one surface excluding the part where the textured surface is created, the base material film having a thickness of 3 to 25 μm, and the textured surface having an arithmetic mean roughness Ra of 0.3 to 3 μm and a size…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K1/0218Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9018533B2 cover?
- Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wirin…
- Who is the assignee on this patent?
- Kawaguchi Toshiyuki, Tahara Kazutoki, Saga Tsutomu, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0218. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).