Precursors and methods for producing bismuth-oxy-carbide-based photoresist
US-2024210821-A1 · Jun 27, 2024 · US
US9017934B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9017934-B2 |
| Application number | US-201313790057-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2013 |
| Priority date | Mar 8, 2013 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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A system and method for reducing defects in photoresist processing is provided. An embodiment comprises cleaning the photoresist after development using an alkaline environment. The alkaline environment may comprise a neutral solvent and an alkaline developer. The alkaline environment will modify the attraction between residue leftover from development and a surface of the photoresist such that the surfaces repel each other, making the removal of the residue easier. By removing more residue, there will be fewer defects in the photolithographic process.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor device, the method comprising: developing a photoresist over a substrate; cleaning the photoresist after the developing, the cleaning the photoresist comprising applying an alkaline environment to a surface of the photoresist to modify the surface of the photoresist to have a first charge and to modify a surface of residue to have the first charge; and after the cleaning the photoresist, rinsing the photoresist w…
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