Conductive path structure and wire harness

US9012777B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9012777-B2
Application numberUS-201113819118-A
CountryUS
Kind codeB2
Filing dateSep 16, 2011
Priority dateSep 16, 2010
Publication dateApr 21, 2015
Grant dateApr 21, 2015

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A conductive path structure comprising: a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion; and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion, wherein when the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion. 2. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a groove is formed. 3. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a notch is formed. 4. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor in which a through hole is formed. 5. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor having a thin portion thinner than the first and second conductive portions. 6. A wire harness including a plurality of conductive paths each having the conductive path structure according to claim 1 .

Assignees

Inventors

Classifications

  • comprising violation sensing means · CPC title

  • B60K28/14Primary

    responsive to accident or emergency, e.g. deceleration, tilt of vehicle · CPC title

  • disconnecting the electric power supply, e.g. the vehicle battery · CPC title

  • H01R3/00Primary

    Electrically-conductive connections not otherwise provided for · CPC title

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Frequently asked questions

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What does patent US9012777B2 cover?
A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conducti…
Who is the assignee on this patent?
Adachi Hideomi, Kuboshima Hidehiko, Yazaki Corp
What technology area does this patent fall under?
Primary CPC classification B60K28/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).