Transparent conductive film and production method therefor
US-2015357077-A1 · Dec 10, 2015 · US
Method of manufacture of multilayer film
US9011985B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9011985-B2 |
| Application number | US-201013503806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 26, 2010 |
| Priority date | Oct 30, 2009 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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Abstract
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A process for producing a multilayer film which, even when bent, is less apt to decrease in barrier property or electrical conductivity. The process comprises forming a barrier film and a transparent conductive film on a resin film to produce a multilayer film. The barrier film is formed by a plasma enhanced CVD method which uses electric discharge between rolls. The transparent conductive film is preferably formed by physical vapor deposition. The resin film preferably is a polyester resin film or a polyolefin resin film.
First claim
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The invention claimed is: 1. A method comprising: manufacturing a multilayer film by forming a barrier film containing silicon, oxygen, and carbon and a transparent conductive film on a resin film, wherein said barrier film is formed by a plasma enhanced CVD method which uses electric discharge between two rolls in which two magnets are provided respectively under a pressure of 0.1 Pa to 10 Pa in a condition where an intermediate frequency is applied between the rolls where a magn…
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Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Operations & Transport · mapped topic
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- What does patent US9011985B2 cover?
- A process for producing a multilayer film which, even when bent, is less apt to decrease in barrier property or electrical conductivity. The process comprises forming a barrier film and a transparent conductive film on a resin film to produce a multilayer film. The barrier film is formed by a plasma enhanced CVD method which uses electric discharge between rolls. The transparent conductive film…
- Who is the assignee on this patent?
- Hasegawa Akira, Kuroda Toshiya, Sanada Takashi, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C23C14/086. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).