Electronic device and manufacturing method thereof
US-2024404831-A1 · Dec 5, 2024 · US
Method and apparatus for trimming the working layers of a double-side grinding apparatus
US9011209B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9011209-B2 |
| Application number | US-201414188707-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2014 |
| Priority date | Jul 28, 2010 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A trimming apparatus for trimming two working layers, including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpieces includes a trimming disk, a plurality of trimming bodies and an outer toothing, where the trimming bodies are configured to release abrasive substances upon contract with the working layers so as to effect material removal from the working layers. At least 80% of the area of the trimming bodies configured to come into contact with the working layers is arranged within a ring-shaped region on the trimming disk. The width of the ring-shaped region is between 1-25% of the diameter of the trimming disk and the area of the trimming bodies which comes into contact with the working layers occupies 20-90% of the total area of the ring-shaped region.
First claim
Opening claim text (preview).
What is claimed is: 1. A trimming apparatus for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and of a lower working disk of a grinding apparatus configured for the simultaneous double-side processing of flat workpieces, the apparatus comprising: a trimming disk, a plurality of trimming bodies; and an outer toothing, wherein the trimming bodies are configured to release abrasive substances upon contact with working layers…
Assignees
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Classifications
- H10P52/00Primary
Electricity · mapped topic
- B24B53/017Primary
Operations & Transport · mapped topic
- B24B37/08Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9011209B2 cover?
- A trimming apparatus for trimming two working layers, including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpieces includes a trimming disk, a plurality of trimming bodies and an outer toothing, where the trimming bodies are configured to release abrasive substances u…
- Who is the assignee on this patent?
- Siltronic Ag
- What technology area does this patent fall under?
- Primary CPC classification H10P52/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).