Cavity shaping and selective metal silicide formation for cmos devices
US-2024203741-A1 · Jun 20, 2024 · US
US9011065B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9011065-B2 |
| Application number | US-87133310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 30, 2010 |
| Priority date | Nov 12, 2009 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.
Opening claim text (preview).
What is claimed is: 1. A vacuum processing apparatus which processes a semiconductor wafer, comprising: an atmospheric transfer chamber having a plurality of cassette stands arranged on a front side thereof for transferring the wafer inside thereof, the wafer being stored in a cassette disposed on one of the plurality of cassette stands; a lock chamber arranged on a rear side of the atmospheric transfer chamber, for storing in an interior thereof the wafer transferred from the a…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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