Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
US-12142594-B2 · Nov 12, 2024 · US
Removal apparatuses for semiconductor chips
US8998068B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8998068-B2 |
| Application number | US-201213527777-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2012 |
| Priority date | Jul 6, 2011 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.
First claim
Opening claim text (preview).
What is claimed is: 1. A removal apparatus for a semiconductor chip, the removal apparatus comprising: a stage configured to support a board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip; a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board; a vacuum portion configured to pr…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W72/0711Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8998068B2 cover?
- A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the …
- Who is the assignee on this patent?
- Park Jaeyong, Ko Junyoung, Sin Whasu, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W72/0711. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).