Optical signal sending apparatus
US-2024235689-A1 · Jul 11, 2024 · US
US8995799B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8995799-B2 |
| Application number | US-201213474809-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2012 |
| Priority date | Nov 2, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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An optoelectronic chip including a coupler region, and a method of manufacturing the same, include a substrate; a coupler region formed of a material having a refractive index lower than the substrate and surrounded by the substrate. The coupler region includes a total reflection surface that totally reflects light incident through a surface of the substrate into the substrate or emits light guided in the substrate through the surface of the substrate.
Opening claim text (preview).
What is claimed is: 1. An optoelectronic chip, comprising: a substrate including a first layer, a second layer and a third layer, sequentially stacked, the first layer having a first surface and a second surface, the first surface being an interface with outside, and the second surface being an interface with the second layer; and a coupler region formed of a material having a refractive index lower than a refractive index of the first layer and surrounded by the first la…
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