Electronic apparatus
US-2024170363-A1 · May 23, 2024 · US
System for clamping heat sink
US8994166B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994166-B2 |
| Application number | US-201113290815-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2011 |
| Priority date | Dec 1, 2006 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment. Accordingly, the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink. To prevent excessive clamping force from damaging the semiconductor device, loading columns may extend between the cover and the heat sink.
First claim
Opening claim text (preview).
I claim: 1. An electronic assembly with a heat sink and semiconductor device comprising: a cover; at least one column extending from the cover to provide a stop at a first surface of the heat sink, where the column maintains a space for the semiconductor device between the cover and the heat sink by limiting a compressive force at the cover; and a fastener configured to attach the heat sink to the cover. 2. The electronic assembly according to claim 1 ,…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W40/611Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8994166B2 cover?
- A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor devic…
- Who is the assignee on this patent?
- Mlotkowski Greg, Harman Int Ind
- What technology area does this patent fall under?
- Primary CPC classification H10W40/611. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).