Method for forming source/drain contacts
US-2024379814-A1 · Nov 14, 2024 · US
US8994097B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994097-B2 |
| Application number | US-201213415611-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2012 |
| Priority date | Mar 8, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Official abstract text for this publication.
A device includes a semiconductor substrate, a gate stack over the semiconductor substrate, and a stressor region having at least a portion in the semiconductor substrate and adjacent to the gate stack. The stressor region includes a first stressor region having a first p-type impurity concentration, a second stressor region over the first stressor region, wherein the second stressor region has a second p-type impurity concentration, and a third stressor region over the second stressor region. The third stressor region has a third p-type impurity concentration. The second p-type impurity concentration is lower than the first and the third p-type impurity concentrations.
Opening claim text (preview).
What is claimed is: 1. A device comprising: a semiconductor substrate; a gate stack over the semiconductor substrate; a gate spacer on an edge of the gate stack; and a stressor region having at least a portion in the semiconductor substrate and adjacent to the gate stack, wherein the stressor region comprises: a first stressor region having a first p-type impurity concentration; a second stressor region over the first stressor region, wherein the second stressor region ha…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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