Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
US8994041B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994041-B2 |
| Application number | US-201214006506-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2012 |
| Priority date | Mar 31, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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This photodiode array module includes a first semiconductor substrate 2 having a first photodiode array that is sensitive to light of a first wavelength band, a second semiconductor substrate 2 ′ having a second photodiode array that is sensitive to light of a second wavelength band, and a third semiconductor substrate 3 which is formed with a plurality of amplifiers AMP and on which the first and second semiconductor substrates 2, 2 ′ are placed side by side without overlapping, and which connects each photodiode to the amplifier AMP via a bump. In adjacent end portions of the first semiconductor substrate 2 and the second semiconductor substrate 2 ′, stepped portions are formed, which thus allows performing measurement with low noise even when respective pixels are aligned successively over both substrates.
Opening claim text (preview).
The invention claimed is: 1. A photodiode array module comprising: a first semiconductor substrate having a first photodiode array that is sensitive to light of a first wavelength band; a second semiconductor substrate having a second photodiode array that is sensitive to light of a second wavelength band; and a third semiconductor substrate which is formed with a plurality of amplifiers and on which the first and second semiconductor substrates are placed side by side without…
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