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Method of evaluating a semiconductor wafer dicing process
US8994022B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994022-B2 |
| Application number | US-201213443778-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 10, 2012 |
| Priority date | Apr 11, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Abstract
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Embodiments of the disclosure relate to a method of evaluating a semiconductor wafer dicing process, comprising providing evaluation lines extending in at least one scribe line of the wafer, dicing the wafer in the scribe line, evaluating the length of the evaluation lines, providing an information about their length, and using the information to evaluate the dicing process.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of evaluating a semiconductor wafer dicing process, the method comprising: providing evaluation lines extending from an evaluation circuit into a first street of a plurality of streets on a wafer, the wafer further including functional circuits, the evaluation circuit and the functional circuits being arranged in columns and rows that are separated by the plurality of streets, the evaluation lines extending from a perimeter of the evaluation c…
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Classifications
- H10P74/277Primary
Electricity · mapped topic
- H01L22/34Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8994022B2 cover?
- Embodiments of the disclosure relate to a method of evaluating a semiconductor wafer dicing process, comprising providing evaluation lines extending in at least one scribe line of the wafer, dicing the wafer in the scribe line, evaluating the length of the evaluation lines, providing an information about their length, and using the information to evaluate the dicing process.
- Who is the assignee on this patent?
- Tailliet Francois, St Microelectronics Rousset
- What technology area does this patent fall under?
- Primary CPC classification H10P74/277. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).