OLED packaging structure and packaging method

US8994018B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8994018-B2
Application numberUS-201314117030-A
CountryUS
Kind codeB2
Filing dateAug 19, 2013
Priority dateAug 7, 2013
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention provides an OLED packaging structure and a packaging method thereof. The OLED packaging structure comprises a packaging board and an OLED substrate. At least one seal frame matching OLED in size is formed through painting glass frit seal on the packaging board at a position corresponding to the OLED. An initial painting point is at every seal frame with a protruding prominence. A recess is set up on the OLED substrate corresponding the initial painting point to accommodate the prominence. the OLED packaging structure and the packaging method thereof is to set up a recess on an OLED substrate to accommodate a prominence on the initial painting point due to accumulation of glass frit seal on a packaging board, so that when adhering the OLED substrate to the packaging board the seal frame is adhesive to the OLED substrate tightly without significant gap. Therefore subsequent laser melding is more successful, to prevent from forming gaps between a packaging board, an OLED substrate and a seal frame, and lifetime of OLED is lengthened.

First claim

Opening claim text (preview).

What is claimed is: 1. An organic light emitting diode (OLED) packaging structure comprising: a packaging board, comprising a seal frame matching an OLED in size, the seal frame formed through painting glass frit seal on the packaging board at a position corresponding to the OLED and comprising a protruding prominence out of the seal frame at an initial painting point; and an OLED substrate, comprising a recess set up on a position aiming the initial painting point to accommodat…

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What does patent US8994018B2 cover?
The present invention provides an OLED packaging structure and a packaging method thereof. The OLED packaging structure comprises a packaging board and an OLED substrate. At least one seal frame matching OLED in size is formed through painting glass frit seal on the packaging board at a position corresponding to the OLED. An initial painting point is at every seal frame with a protruding promin…
Who is the assignee on this patent?
Shenzhen China Star Optoelect, Shenzhen China Star Optoelect
What technology area does this patent fall under?
Primary CPC classification H10K50/8426. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).