Method and Apparatus for Laser Cutting Transparent and Semitransparent Substrates
US-2015367442-A1 · Dec 24, 2015 · US
US8993922B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993922-B2 |
| Application number | US-58545104-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2004 |
| Priority date | Jan 9, 2004 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided. This laser processing method comprises a displacement acquiring step (S 07 to S 11 ) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
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The invention claimed is: 1. A laser processing method for irradiating an object to be processed with a first laser beam while converging the first laser beam with a lens such that a converging point is positioned within the object, and forming a modified region within the object along a cutting line, the method comprising: a height acquiring step of irradiating the object with a second laser beam for measuring height of a main surface of the object in an optical axis direction of…
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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