Silicide micromechanical device and methods to fabricate same

Patent metadata

Field	Value
Publication number	US-8993907-B2
Application number	US-201213625294-A
Country	US
Kind code	B2
Filing date	Sep 24, 2012
Priority date	Jun 20, 2011
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

A miniaturized electro-mechanical switch includes a moveable portion having a contact configured to make, when the switch is actuated, an electrical connection between two stationary points. At least the contact is composed of a fully silicided material. A structure includes a silicon layer formed over an insulator layer and a micromechanical switch formed at least partially within the silicon layer. The micromechanical switch has a conductive structure, and where at least electrically contacting portions of the conductive structure are comprised of fully silicided material.

First claim

What is claimed is:

1. A switch, comprising a moveable portion configured to physically move between a first position and a second position, the moveable portion comprising a contact configured to make, when the switch is actuated and the moveable portion is in the first position, an electrical connection between two stationary points, and when the switch is not actuated and the moveable portion is in the second position, to open the electrical connection between the two stationary points, where at least an entirety of said moveable portion including said contact is comprised of a fully silicided material.

2. The switch as in claim 1 , where said fully silicided material is comprised of PtSi, or NiSi, or WSi, or ErSi, or YbSi, or TiSi, or CoSi.

3. The switch as in claim 1 , comprised of a MEMS or a NEMS switch.

4. A structure, comprising:
a substrate comprising a silicon layer formed over an insulator layer; and
a micromechanical switch formed at least partially within the silicon layer, the micromechanical switch comprising a conductive structure comprising a moveable portion configured to physically move between a first position and a second position, the moveable portion comprising a contact configured to make, when the switch is actuated and the moveable portion is in the first position, an electrical connection between two stationary points, and when the switch is not actuated and the moveable portion is in the second position, to open the electrical connection between the two stationary points, where at least an entirety of said moveable portion including electrically contacting portions of the conductive structure and including said contact are comprised of fully silicided material.

5. The structure as in claim 4 , where the fully silicided material is comprised of PtSi, or NiSi, or WSi, or ErSi, or YbSi, or TiSi, or CoSi.

6. The structure as in claim 4 , where said micromechanical switch is comprised of a MEMS or a NEMS switch.

7. The structure as in claim 4 , where at least a moveable portion of said conductive structure is released from said insulator layer.

8. An electro-mechanical switch device fabricated by a process that comprises:
providing a silicon layer disposed over an insulating layer;
releasing a portion of the silicon layer from the insulating layer so that it is at least partially suspended over a cavity in the insulating layer;
depositing a metal on at least one surface of at least the released portion of the silicon layer; and
fully siliciding at least the released portion of the silicon layer using the deposited metal, where the fully silicided released portion functions as a moveable current carrying member of the switch device configured to physically move between a first position and a second position, the moveable current carrying member comprising a contact configured to make, when the switch device is actuated and the moveable current carrying member is in the first position, an electrical connection between two stationary points, and when the switch device is not actuated and the moveable current carrying member is in the second position, to open the electrical connection between the two stationary points.

9. The switch device of claim 8 , where no wet chemical etching process is performed subsequent to releasing the portion of the silicon layer.

10. The switch device of claim 8 , where releasing is performed using a HF vapor.

11. The switch device of claim 8 , where depositing a metal is comprised of depositing a layer comprised of carbon so that it fills the cavity, removing a portion of the layer comprised of carbon so as expose a top surface of the released portion of the silicon layer and surrounding portions of the silicon layer, using atomic layer deposition to form the layer of metal on the exposed top surface, and removing the remainder of the layer comprised of carbon prior to fully siliciding.

12. The switch device of claim 8 , where the step of releasing forms the cavity so that an underlying top surface of a silicon substrate is exposed at the bottom of the cavity, and where depositing a metal is comprised of applying self-assembled monolayers to sidewalls of the cavity, and using atomic layer deposition to form the layer of metal on exposed surfaces of the released portion of the silicon layer, surrounding portions of the silicon layer, and the exposed surface of the silicon substrate, but not on the sidewalls of the cavity.

13. The switch device of claim 8 , where the step of releasing forms the cavity so that an underlying top surface of a silicon substrate is exposed at the bottom of the cavity, and where depositing a metal is comprised of evaporating the metal to form the layer of metal on exposed surfaces of the released portion of the silicon layer, surrounding portions of the silicon layer, the exposed surface of the silicon substrate not underlying the released portion of the silicon layer, but not on the sidewalls of the cavity.

14. The switch device of claim 8 , where the step of releasing forms the cavity so that an underlying top surface of a silicon substrate is exposed at the bottom of the cavity, and where depositing a metal is comprised of sputtering the metal to form the layer of metal on exposed surfaces of the released portion of the silicon layer, surrounding portions of the silicon layer, the exposed surface of the silicon substrate not underlying the released portion of the silicon layer, and on sidewalls of the cavity, where fully siliciding silicides the sputtered metal on the released portion of the silicon layer, the surrounding portions of the silicon layer and the exposed surface of the silicon substrate not underlying the released portion of the silicon layer, and further comprising forming a protective oxide layer selectively only on fully silicided surfaces, removing the sputtered metal from the sidewalk of the cavity, and removing the protective oxide layer.

15. The switch device of claim 8 , where the metal is comprised of one of Pt, Ni, W, Er, Yb, Ti, Co, and where the fully silicided released portion of the silicon layer is composed of PtSi, or NiSi, or WSi, or ErSi, or YbSi, or TiSi, or Co Si.

16. The switch device of claim 8 , where fully siliciding uses a thermal process that is performed in a range of about 300° C. to about 750° C.

17. The switch device of claim 16 , where the thermal process is comprised of heating in a nitrogen atmosphere followed by heating in an oxygen atmosphere.

18. The switch device of claim 14 , where fully siliciding uses a thermal process that comprises heating in a nitrogen atmosphere, and where forming the protective oxide layer selectively only on fully silicided surfaces comprises heating in an oxygen atmosphere.

19. The switch device of claim 11 , where the layer comprised of carbon is removed using a plasma.

20. The switch device of claim 8 , where the switch device is one of a MEMS or NEMS switch device.

Assignees

• IBM

Inventors

• Guillorn Michael A
• Joseph Eric A
• Liu Fei
• Zhang Zhen

Classifications

• B81C1/00952

  Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944 · CPC title

• H01H2001/0078

  with parallel movement of the movable contact relative to the substrate · CPC title

• B81C1/00666 Primary

  Treatments for controlling internal stress or strain in MEMS structures · CPC title

• H01H1/0094

  Switches making use of nanoelectromechanical systems [NEMS] · CPC title