Reflective layer-equipped substrate for EUV lithography, reflective mask blank for EUV lithography, reflective mask for EUV lithography, and process for production of the reflective layer-equipped substrate

US8993201B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993201-B2
Application numberUS-201213478532-A
CountryUS
Kind codeB2
Filing dateMay 23, 2012
Priority dateDec 9, 2009
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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Abstract

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Provided are an EUV mask blank in which deterioration in reflectivity due to oxidation of a Ru protective layer is prevented, a reflective layer-equipped substrate to be used for producing the EUV mask blank, and a process for producing the reflective layer-equipped substrate. A reflective layer-equipped substrate for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light and a protective layer for protecting the reflective layer, formed in this order on the substrate, wherein the reflective layer is a Mo/Si multilayer reflective film, the protective layer is a Ru layer or a Ru compound layer, and an intermediate layer containing from 0.5 to 25 at % of nitrogen and from 75 to 99.5 at % of Si is formed between the reflective layer and the protective layer.

First claim

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What is claimed is: 1. A reflective layer-equipped substrate for EUV lithography, comprising: a substrate; a reflective layer which reflects EUV light and is formed on the substrate; an intermediate layer formed on the reflective layer; and a protective layer which protects the reflective layer and is formed on the intermediate layer, wherein the reflective layer comprises a Mo/Si multilayer reflective film, the protective layer comprises a Ru layer or a Ru compound layer,…

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What does patent US8993201B2 cover?
Provided are an EUV mask blank in which deterioration in reflectivity due to oxidation of a Ru protective layer is prevented, a reflective layer-equipped substrate to be used for producing the EUV mask blank, and a process for producing the reflective layer-equipped substrate. A reflective layer-equipped substrate for EUV lithography comprising a substrate, and a reflective layer for reflecting…
Who is the assignee on this patent?
Mikami Masaki, Komakine Mitsuhiko, Ikuta Yoshiaki, and 1 more
What technology area does this patent fall under?
Primary CPC classification G03F1/24. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).