Method and apparatus for cleaning semiconductor wafer
US-2015332940-A1 · Nov 19, 2015 · US
US8992691B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8992691-B2 |
| Application number | US-201113080097-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 5, 2011 |
| Priority date | Apr 5, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A method of implementing cleaning solution replacement in a recyclable fluid cleaning system for semiconductor wafers includes activating electrode current for an electrolysis reactor included in the cleaning system. At least one of electrode voltage and operating time for the electrolysis reactor is monitored, until a trigger point has been reached. The trigger point includes one of the electrode voltage reaching a predetermined threshold voltage value, a process time counter reaching a predetermined counter value, and a time value that the electrode voltage has been at the threshold voltage value reaching predetermined value. The process time counter is incremented based on one or more of actual wafer processing time, wafer type, number of wafers processed, and thickness of material to be stripped. Upon reaching the trigger point, the electrode current is deactivated, and at least a portion of cleaning system fluid is drained and replaced with fresh cleaning fluid.
Opening claim text (preview).
What is claimed is: 1. A method of implementing cleaning solution replacement in a recyclable fluid cleaning system for semiconductor wafers, the method comprising: activating electrode current through electrodes of an electrolysis reactor included in the cleaning system; analyzing an electrode voltage of the electrodes of the electrolysis reactor as a function of time until a trigger point has been reached, wherein the trigger point comprises the electrode voltage of the electr…
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