Connector having a reduced height and increased soldering strength and socket for use in the same

US8992233B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8992233-B2
Application numberUS-201113879775-A
CountryUS
Kind codeB2
Filing dateOct 7, 2011
Priority dateOct 19, 2010
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connector that electrically connects circuit boards to each other by fitting a header 20 and a socket 10 to each other, the connector including: header holding fixtures 24 for holding the header 20 to the circuit board; and a socket molded article 11 as a molded article of the socket 10 , wherein recessed portions 16 with a recessed shape are formed on the socket molded article 11 so that soldering terminals of the header holding fixtures 24 cannot interfere with the socket molded article 11 when the header 20 and the socket 10 are fitted to each other.

First claim

Opening claim text (preview).

The invention claimed is: 1. A connector that electrically connects circuit boards to each other by fitting a header and a socket to each other, the connector comprising: header holding fixtures for holding the header on the circuit board; and a socket molded article as a molded article of the socket, wherein recessed portions with a recessed shape are formed on the socket molded article so that soldering terminals of the header holding fixtures cannot interfere with the socke…

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What does patent US8992233B2 cover?
A connector that electrically connects circuit boards to each other by fitting a header 20 and a socket 10 to each other, the connector including: header holding fixtures 24 for holding the header 20 to the circuit board; and a socket molded article 11 as a molded article of the socket 10 , wherein recessed portions 16 with a recessed shape are formed on the socket molded article …
Who is the assignee on this patent?
Miyazaki Yoji, Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01R12/71. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).