Wafer processing apparatus for combined high-pressure process and vacuum process, and wafer processing method using decompression
US-2024339338-A1 · Oct 10, 2024 · US
Substrate support structure, clamp preparation unit, and lithography system
US8991330B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8991330-B2 |
| Application number | US-70964510-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 22, 2010 |
| Priority date | Feb 22, 2009 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings. The substrate support structure comprises a surface provided with a plurality of substrate supporting elements for holding the substrate, and the surface further comprises portions with different capillary potential for inducing, during clamping, a predetermined capillary flow within the liquid clamping layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings and having an outer liquid surface, the substrate support structure comprising a surface provided with a plurality of substrate supporting elements for holding the substrate, the surface of the substrate support structure comprising a perimeter being circumscribed by a moat, and further com…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/00Primary
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8991330B2 cover?
- A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings. The substrate support structure comprises a surface provided with a plurality of substrate supporting elements for holding the substrate, and the surface further comprises portions with different capillary potential for inducing, …
- Who is the assignee on this patent?
- De Jong Hendrik Jan, Mapper Lithography Ip Bv
- What technology area does this patent fall under?
- Primary CPC classification H10P72/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).