Sensor and electronic device
US-2024310404-A1 · Sep 19, 2024 · US
Microelectromechanical system
US8991253B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8991253-B2 |
| Application number | US-201113241333-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2011 |
| Priority date | Sep 28, 2010 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator.
First claim
Opening claim text (preview).
What is claimed is: 1. A microelectromechanical system, comprising: a chip; a substrate; a signal generator; and a coupling structure configured to couple the chip to the substrate; wherein the chip is coupled in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate, and wherein a signal is generated by the relative movement of the chip by means of the signal generator; wherein the chip is embodied as a si…
Assignees
Inventors
Classifications
Physics · mapped topic
Physics · mapped topic
- G01P15/08Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8991253B2 cover?
- In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by mean…
- Who is the assignee on this patent?
- Theuss Horst, Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification G01P15/08. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).