Heat pump system

US8991199B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8991199-B2
Application numberUS-201013202623-A
CountryUS
Kind codeB2
Filing dateFeb 23, 2010
Priority dateFeb 24, 2009
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat pump system includes: a heat-source-side refrigerant circuit having a heat-source-side compressor, a first usage-side heat exchanger operable as a radiator of heat-source-side refrigerant, and a heat-source-side heat exchanger operable as an evaporator of heat-source-side refrigerant; and a usage-side refrigerant circuit having a usage-side compressor arranged to compress usage-side refrigerant with a pressure of the usage-side refrigerant corresponding to a saturated gas temperature of 65° C. that is 2.8 MPa or less at gauge pressure, a refrigerant-water heat exchanger operable as a radiator of usage-side refrigerant to heat an aqueous medium, and a first usage-side heat exchanger operable as an evaporator of usage-side refrigerant by the radiation of heat-source-side refrigerant. The weight of usage-side refrigerant enclosed in the usage-side refrigerant circuit is one to three times the weight of refrigeration machine oil enclosed to lubricate the usage-side compressor.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat pump system comprising: a heat-source-side refrigerant circuit having a heat-source-side compressor arranged to compress a heat-source-side refrigerant, a first usage-side heat exchanger operable as a radiator of the heat-source-side refrigerant, a heat-source-side heat exchanger operable as an evaporator of the heat-source-side refrigerant, and an oil separation mechanism arranged to separate refrigeration machine oil included in the heat-sour…

Assignees

Inventors

Classifications

  • Mechanical Engineering · mapped topic

  • F25B7/00Primary

    Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

  • F25B1/00Primary

    Mechanical Engineering · mapped topic

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Frequently asked questions

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What does patent US8991199B2 cover?
A heat pump system includes: a heat-source-side refrigerant circuit having a heat-source-side compressor, a first usage-side heat exchanger operable as a radiator of heat-source-side refrigerant, and a heat-source-side heat exchanger operable as an evaporator of heat-source-side refrigerant; and a usage-side refrigerant circuit having a usage-side compressor arranged to compress usage-side refr…
Who is the assignee on this patent?
Honda Masahiro, Daikin Ind Ltd, Daikin Europe Nv
What technology area does this patent fall under?
Primary CPC classification F25B7/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).