Method for manufacturing bimorph actuator
US-9343655-B2 · May 17, 2016 · US
Method of manufacturing liquid ejecting head, method of manufacturing liquid ejecting apparatus and method of manufacturing piezoelectric element
US8991052B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8991052-B2 |
| Application number | US-201213707035-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2012 |
| Priority date | Dec 8, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Abstract
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A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer, and forming a second electrode on the piezoelectric layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a liquid ejecting head comprising: forming a first electrode made of platinum; forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth (Bi) or platinum (Pt) on the first electrode; forming an oxide layer made of an oxide containing bismuth on the buffer layer; forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer; an…
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Operations & Transport · mapped topic
- H01L41/22Primary
Electricity · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
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- What does patent US8991052B2 cover?
- A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that c…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification H01L41/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).