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US-2024381034-A1 · Nov 14, 2024 · US
Method of manufacturing a piezoelectric speaker
US9219971B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9219971-B2 |
| Application number | US-201213671502-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2012 |
| Priority date | Dec 8, 2009 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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Abstract
Official abstract text for this publication.
A method of manufacturing a piezoelectric speaker comprises forming a piezoelectric thin film and then forming an upper electrode and a lower electrode on and beneath the piezoelectric thin film, respectively, forming a damping material layer for attachment of the piezoelectric thin film below the piezoelectric thin film with the upper and lower electrodes formed thereon and therebeneath, attaching the piezoelectric thin film to an acoustic diaphragm in an inclined structure in which the piezoelectric thin film is horizontally turned from the acoustic diaphragm, and performing drying at room temperature; and fixing the acoustic diaphragm to a frame using an adhesive material with high elasticity.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a piezoelectric speaker, the method comprising: forming a piezoelectric thin film, and then forming an upper electrode on a first side of the piezoelectric thin film and forming a lower electrode on a second side of the piezoelectric thin film; forming a damping material layer; attaching the lower electrode disposed on the piezoelectric thin film to an acoustic diaphragm with the damping material layer interposed between the lo…
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Cross-Sectional Technologies · mapped topic
- H04R31/006Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9219971B2 cover?
- A method of manufacturing a piezoelectric speaker comprises forming a piezoelectric thin film and then forming an upper electrode and a lower electrode on and beneath the piezoelectric thin film, respectively, forming a damping material layer for attachment of the piezoelectric thin film below the piezoelectric thin film with the upper and lower electrodes formed thereon and therebeneath, attac…
- Who is the assignee on this patent?
- Korea Electronics Telecomm
- What technology area does this patent fall under?
- Primary CPC classification H04R31/006. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).